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| MHC（孔金屬化） | ||
|---|---|---|
| Sub-Segment | Process（制程） | Product（產(chǎn)品） |
| HDI/SLP | E'less Cu | CP4000 |
| L/S,Process | H/VCP | L/S 30/30 MSAP |
| HDI High End/ELIC | H'Eless Cu | CP4000 |
| CP6700(ionic Pd) | ||
| HDI Conventional | H'Eless Cu | CP3350-1/CP6300(ionic Pd) |
| Traditionalfor PC, Consumer | H'Eless Cu | |
| Cost effective | V'Eless Cu | CP880/LC9100 |
| Advanced for Auto/ Telecom | H'Eless Cu | CP4000 |
| V'Eless Cu | CP253/CP880/CP3000 | |
| Desmear | HP3303/4216, | |
| Build up layer | SAP E’less Cu Ionic (major) | Gen 1: Ionic Pd SAP, CP ADV8500 ABF GX/GL, Sekisui NX, Mid Ra |
| SAP Desmear | Gen 1 SAP Desmear, CP7800 ABF GX3/GX13. Sekisui NX, Mid Ra | |
| Core layer | H' Eless Cu | CP4000 |
| DS/ML/RF | Direct Plating | CP680/CP4000, ELF(EF-65) |
| Mark: Eless Cu除CP6300/CP6700離子鈀外，其余為膠體鈀 | ||
| EP Cu （電鍍銅） | ||
|---|---|---|
| Sub-Segment | Process（制程） | Product（產(chǎn)品） |
| HDI/ELIC | Panel viafill+TH Plating | EVF,EVF15/HC650,LVF,EVFⅢ(Cu 18um; 80% TP of TH Distribution +/-1.5um) |
| SLP | pattern viafill | LVF-Ⅳ |
| Telecom/Server (AR﹥16) | Conformal Plating (Pulse) | "CuPulse*/PPR* PPRII” (100% TP of TH for AR~17 board)" |
| Telecom/Server (AR10-16) | Conformal Plating (DC) | EP1000”/EP1400”/EP1500* ,EP1600* (>80% TP of TH at 8-12ASF) |
| Automotive(AR﹤10) | Conformal Plating (DC) | HS200/HV606/ST901/HV101/ST920, HV609S(AR8:1,80%TP at 30ASF) |
| FC/SiP/ETS/RDL | pattern viafill | THF-100/VHF, LVH-Ⅳ,SFP |
| Consumer, Smartphone | Panel viafill | "HS200/HV606 CLX/HGX/HV303, HSV-100 (Ultra thin Cu 15um; 5ASD)" |
